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Tender for Custom Bid for Services - Semiconductor Bga Package Manufacturability Validation of Flip Chip Bump, Qty: 1 from Kerala. The reference number of the tender is: 97882407 and the same is closing on 11th Mar 2024. Users can register on the site to get similar tenders.

Procurement Summary

Country : India

State : Kerala

Summary : Custom Bid for Services - Semiconductor Bga Package Manufacturability Validation of Flip Chip Bump, Qty: 1

Deadline : 11 Mar 2024

Purchaser's Detail

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Other Information

Notice Type : Tender

RefID : 97882407

Notice Ref. No. : GEM/2024/B/4712910

Tender Value : ₹ 10000000

Tender EMD : Refer Document

Tender Document Cost : Refer Document

Competition : NCB

Financier : Self Financed

Purchaser Ownership : Public

Tender's Details

Custom Bid for Services - Semiconductor BGA Package manufacturability Validation of Flip chip bump routing for Vega based SoC ASIC DHRUV64 in TSMC 28nm HPC process
Quantity Required: 1
Start Date: 29-02-2024 5:00 PM
End Date: 11-03-2024 5:00 PM

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